Kurukshetra, Haryana
- GST NO. : 06HHVPK3908L1ZL
Conductive Paste
Leading Manufacturers, Exporters and Wholesaler of Conductive Silver Paste and High Thermally Conductive Paste from Kurukshetra.
| Business Type | Manufacturer, Exporter, Supplier |
| Purity | 99.9 % |
| Molecular Weight | 107.87 g/mol |
| Resistivity | 1.59 micro ohm/cm at 20 Degree C |
| Maximum Service Temp. | 150 Degree C |
| Packaging Type | Box |
| Storage Conditions | Airtight sealed, Avoid light and keep dry at Room Temperature. |
Preferred Buyer From
| Location | Worldwide |
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.
| Business Type | Manufacturer, Exporter, Supplier |
| Brand | Graphene-Bond |
| Color | Grey |
| Material | Graphene Based |
| Usage/Application | For heat sink application |
| Thermal Conductivity | 8 to 10 W/mK |
| RoHS Compliant | Yes |
| Minimum Temperature | - 70 Degree C |
| Maximum Temperature | 150 Degree C |
| Storage Conditions | Airtight sealed, Avoid light and keep dry at Room Temperature. |
Preferred Buyer From
| Location | Worldwide |
Thermal paste also called thermal compound, thermal grease, thermal interface material is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to apply pressure, spreading the thermal paste.
