High Thermally Conductive Paste

50 Litre (MOQ)

Business Type Manufacturer, Exporter, Supplier
Brand Graphene-Bond
Color Grey
Material Graphene Based
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Preferred Buyer From

Location Worldwide

Product Details

For heat sink application
Thermal Conductivity
8 to 10 W/mK
RoHS Compliant
Minimum Temperature
- 70 Degree C
Maximum Temperature
150 Degree C
Storage Conditions
Airtight sealed, Avoid light and keep dry at Room Temperature.

Thermal paste also called thermal compound, thermal grease, thermal interface material is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to apply pressure, spreading the thermal paste.

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